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| MCR100 Series Preferred Device Sensitive Gate Silicon Controlled Rectifiers Reverse Blocking Thyristors PNPN devices designed for high volume, line-powered consumer applications such as relay and lamp drivers, small motor controls, gate drivers for larger thyristors, and sensing and detection circuits. Supplied in an inexpensive plastic TO-226AA package which is readily adaptable for use in automatic insertion equipment. Features http://onsemi.com SCRs 0.8 A RMS 100 thru 600 V * Sensitive Gate Allows Triggering by Microcontrollers and Other * * * * * * * Logic Circuits Blocking Voltage to 600 V On-State Current Rating of 0.8 Amperes RMS at 80C High Surge Current Capability - 10 A Minimum and Maximum Values of IGT, VGT and IH Specified for Ease of Design Immunity to dV/dt - 20 V/msec Minimum at 110C Glass-Passivated Surface for Reliability and Uniformity Pb-Free Packages are Available* G A K MARKING DIAGRAM MCR 100-x AYWW 1 TO-92 (TO-226) CASE 029 STYLE 10 2 3 x A Y WW = Specific Device Code = Assembly Location = Year = Work Week PIN ASSIGNMENT 1 2 3 Cathode Gate Anode ORDERING INFORMATION See detailed ordering and shipping information in the package dimensions section on page 2 of this data sheet. Preferred devices are recommended choices for future use and best overall value. *For additional information on our Pb-Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. (c) Semiconductor Components Industries, LLC, 2005 1 January, 2005 - Rev. 6 Publication Order Number: MCR100/D MCR100 Series ORDERING INFORMATION Device MCR100-003 MCR100-004 MCR100-006 MCR100-008 MCR100-3RL MCR100-6RL MCR100-6RLRA MCR100-6RLRM MCR100-6ZL1 MCR100-8RL MCR100-003G MCR100-006G MCR100-008G MCR100-3RLG MCR100-6RLG MCR100-6RLRAG MCR100-6RLRMG MCR100-6ZL1G MCR100-8RLG 2000 Units / Tape & Ammunition Box 2000 Units / Tape & Reel TO-92 (TO-226) TO 92 (TO 226) (Pb-Free) 2000 Units / Tubes 2000 Units / Tape & Reel 5000 Units / Bulk 2000 Units / Tape & Ammunition Box 2000 Units / Tape & Reel TO-92 (TO-226) TO 92 (TO 226) 2000 Units / Tape & Reel 5000 Units / Bulk Package Code Shipping For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. MAXIMUM RATINGS (TJ = 25C unless otherwise noted) Rating Peak Repetitive Off-State Voltage (Note 1) (TJ = *40 to 110C, Sine Wave, 50 to 60 Hz; Gate Open) MCR100-3 MCR100-4 MCR100-6 MCR100-8 On-State RMS Current, (TC = 80C) 180 Conduction Angles Peak Non-Repetitive Surge Current, (1/2 Cycle, Sine Wave, 60 Hz, TJ = 25C) Circuit Fusing Consideration, (t = 8.3 ms) Forward Peak Gate Power, (TA = 25C, Pulse Width v 1.0 ms) Forward Average Gate Power, (TA = 25C, t = 8.3 ms) Forward Peak Gate Current, (TA = 25C, Pulse Width v 1.0 ms) Reverse Peak Gate Voltage, (TA = 25C, Pulse Width v 1.0 ms) Operating Junction Temperature Range @ Rate VRRM and VDRM Storage Temperature Range IT(RMS) ITSM I2t PGM PG(AV) IGM VGRM TJ Tstg Symbol VDRM, VRRM 100 200 400 600 0.8 10 0.415 0.1 0.10 1.0 5.0 -40 to 110 -40 to 150 A A A2s W W A V C C Value Unit V Maximum ratings are those values beyond which device damage can occur. Maximum ratings applied to the device are individual stress limit values (not normal operating conditions) and are not valid simultaneously. If these limits are exceeded, device functional operation is not implied, damage may occur and reliability may be affected. 1. VDRM and VRRM for all types can be applied on a continuous basis. Ratings apply for zero or negative gate voltage; however, positive gate voltage shall not be applied concurrent with negative potential on the anode. Blocking voltages shall not be tested with a constant current source such that the voltage ratings of the devices are exceeded. http://onsemi.com 2 MCR100 Series THERMAL CHARACTERISTICS Characteristic Thermal Resistance,Junction-to-Case Junction-to-Ambient Lead Solder Temperature (t1/16 from case, 10 secs max) Symbol RqJC RqJA TL Max 75 200 260 Unit C/W C ELECTRICAL CHARACTERISTICS (TC = 25C unless otherwise noted) Characteristic Symbol Min Typ Max Unit OFF CHARACTERISTICS Peak Repetitive Forward or Reverse Blocking Current (Note 2) TC = 25C TC = 110C (VD = Rated VDRM and VRRM; RGK = 1 kW) IDRM, IRRM - - - - 10 100 mA ON CHARACTERISTICS Peak Forward On-State Voltage* (ITM = 1.0 A Peak @ TA = 25C) Gate Trigger Current (Continuous dc) (Note 3) (VAK = 7.0 Vdc, RL = 100 W) Holding Current(2) (VAK = 7.0 Vdc, Initiating Current = 20 mA) Latch Current (VAK = 7.0 V, Ig = 200 mA) Gate Trigger Voltage (Continuous dc) (Note 3) (VAK = 7.0 Vdc, RL = 100 W) TC = -40C TC = 25C TC = 25C TC = -40C TC = 25C TC = -40C TC = 25C VTM IGT IH IL VGT - - - - - - - - - 40 0.5 - 0.6 - 0.62 - 1.7 200 5.0 10 10 15 0.8 1.2 V mA mA mA V DYNAMIC CHARACTERISTICS Critical Rate of Rise of Off-State Voltage (VD = Rated VDRM, Exponential Waveform, RGK = 1000 W,TJ = 110C) Critical Rate of Rise of On-State Current (IPK = 20 A; Pw = 10 msec; diG/dt = 1 A/msec, Igt = 20 mA) *Indicates Pulse Test: Pulse Width 1.0 ms, Duty Cycle 1%. 2. RGK = 1000 W included in measurement. 3. Does not include RGK in measurement. dV/dt di/dt 20 - 35 - - 50 V/ms A/ms Voltage Current Characteristic of SCR + Current Anode + VTM on state IRRM at VRRM IH Symbol VDRM IDRM VRRM IRRM VTM IH Parameter Peak Repetitive Off State Forward Voltage Peak Forward Blocking Current Peak Repetitive Off State Reverse Voltage Peak Reverse Blocking Current Peak on State Voltage Holding Current Reverse Blocking Region (off state) Reverse Avalanche Region Anode - + Voltage IDRM at VDRM Forward Blocking Region (off state) http://onsemi.com 3 MCR100 Series 100 GATE TRIGGER VOLTAGE (VOLTS) 95 90 GATE TRIGGER CURRENT ( m A) 80 70 60 50 40 30 20 10 -40 -25 -10 5 20 35 50 65 80 TJ, JUNCTION TEMPERATURE (C) 110 1.0 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 -40 -25 -10 5 20 35 50 65 80 TJ, JUNCTION TEMPERATURE (C) 95 110 Figure 1. Typical Gate Trigger Current versus Junction Temperature Figure 2. Typical Gate Trigger Voltage versus Junction Temperature 1000 1000 100 LATCHING CURRENT ( m A) 95 110 HOLDING CURRENT (m A) 100 10 -40 -25 -10 5 20 35 50 65 80 TJ, JUNCTION TEMPERATURE (C) 10 -40 -25 -10 5 20 35 50 65 80 TJ, JUNCTION TEMPERATURE (C) 95 110 Figure 3. Typical Holding Current versus Junction Temperature Figure 4. Typical Latching Current versus Junction Temperature TC, MAXIMUM ALLOWABLE CASE TEMPERATURE ( C) I T, INSTANTANEOUS ON-STATE CURRENT (AMPS) 120 110 100 90 DC 80 70 60 50 40 0 0.1 30 60 90 120 0.5 180 10 MAXIMUM @ TJ = 25C MAXIMUM @ TJ = 110C 1 0.2 0.3 0.4 IT(RMS), RMS ON-STATE CURRENT (AMPS) 0.1 0.5 0.8 1.1 1.4 1.7 2.0 2.3 2.6 2.9 3.2 3.5 VT, INSTANTANEOUS ON-STATE VOLTAGE (VOLTS) Figure 5. Typical RMS Current Derating Figure 6. Typical On-State Characteristics http://onsemi.com 4 MCR100 Series TO-92 EIA RADIAL TAPE IN FAN FOLD BOX OR ON REEL H2A H2A H2B H2B H W2 H4 H5 L1 L F1 P2 P1 P H1 W1 W T T2 P2 D T1 F2 Figure 7. Device Positioning on Tape Specification Inches Symbol D D2 F1, F2 H H1 H2A H2B H4 H5 L L1 P P1 P2 T T1 T2 W W1 W2 Millimeter Max Min 3.8 0.38 2.4 1.5 8.5 0 0 18 15.5 8.5 2.5 12.5 5.95 3.55 0.15 -- 0.35 17.5 5.5 .15 Item Tape Feedhole Diameter Component Lead Thickness Dimension Component Lead Pitch Bottom of Component to Seating Plane Feedhole Location Deflection Left or Right Deflection Front or Rear Feedhole to Bottom of Component Feedhole to Seating Plane Defective Unit Clipped Dimension Lead Wire Enclosure Feedhole Pitch Feedhole Center to Center Lead First Lead Spacing Dimension Adhesive Tape Thickness Overall Taped Package Thickness Carrier Strip Thickness Carrier Strip Width Adhesive Tape Width Adhesive Tape Position Min 0.1496 0.015 0.0945 .059 0.3346 0 0 0.7086 0.610 0.3346 0.09842 0.4921 0.2342 0.1397 0.06 -- 0.014 0.6889 0.2165 .0059 Max 4.2 0.51 2.8 4.0 9.5 1.0 1.0 19.5 16.5 11 -- 12.9 6.75 3.95 0.20 1.44 0.65 19 6.3 0.5 0.1653 0.020 0.110 .156 0.3741 0.039 0.051 0.768 0.649 0.433 -- 0.5079 0.2658 0.1556 0.08 0.0567 0.027 0.7481 0.2841 0.01968 NOTES: 1. Maximum alignment deviation between leads not to be greater than 0.2 mm. 2. Defective components shall be clipped from the carrier tape such that the remaining protrusion (L) does not exceed a maximum of 11 mm. 3. Component lead to tape adhesion must meet the pull test requirements. 4. Maximum non-cumulative variation between tape feed holes shall not exceed 1 mm in 20 pitches. 5. Holddown tape not to extend beyond the edge(s) of carrier tape and there shall be no exposure of adhesive. 6. No more than 1 consecutive missing component is permitted. 7. A tape trailer and leader, having at least three feed holes is required before the first and after the last component. 8. Splices will not interfere with the sprocket feed holes. http://onsemi.com 5 MCR100 Series PACKAGE DIMENSIONS TO-92 (TO-226) CASE 029-11 ISSUE AL A R P L SEATING PLANE B NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. CONTOUR OF PACKAGE BEYOND DIMENSION R IS UNCONTROLLED. 4. LEAD DIMENSION IS UNCONTROLLED IN P AND BEYOND DIMENSION K MINIMUM. INCHES MIN MAX 0.175 0.205 0.170 0.210 0.125 0.165 0.016 0.021 0.045 0.055 0.095 0.105 0.015 0.020 0.500 --- 0.250 --- 0.080 0.105 --- 0.100 0.115 --- 0.135 --- MILLIMETERS MIN MAX 4.45 5.20 4.32 5.33 3.18 4.19 0.407 0.533 1.15 1.39 2.42 2.66 0.39 0.50 12.70 --- 6.35 --- 2.04 2.66 --- 2.54 2.93 --- 3.43 --- K XX G H V 1 D J C SECTION X-X N N DIM A B C D G H J K L N P R V STYLE 10: PIN 1. CATHODE 2. GATE 3. ANODE ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. "Typical" parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including "Typicals" must be validated for each customer application by customer's technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. PUBLICATION ORDERING INFORMATION LITERATURE FULFILLMENT: Literature Distribution Center for ON Semiconductor P.O. Box 61312, Phoenix, Arizona 85082-1312 USA Phone: 480-829-7710 or 800-344-3860 Toll Free USA/Canada Fax: 480-829-7709 or 800-344-3867 Toll Free USA/Canada Email: orderlit@onsemi.com N. American Technical Support: 800-282-9855 Toll Free USA/Canada Japan: ON Semiconductor, Japan Customer Focus Center 2-9-1 Kamimeguro, Meguro-ku, Tokyo, Japan 153-0051 Phone: 81-3-5773-3850 ON Semiconductor Website: http://onsemi.com Order Literature: http://www.onsemi.com/litorder For additional information, please contact your local Sales Representative. http://onsemi.com 6 MCR100/D |
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